PRODUCT
PRODUCT
ESS-106 is a chemical immersion process specifically designed to remove excess spills from microelectronic products after packaging. After this process, excess spills can be removed with high pressure water. ESS-106 does not attack metal materials such as copper and alloys in the lead frame during the immersion process, and is suitable for all electronic plastic sealing products.
View more 
Room temperature soaking solution
The ESS-108 is specifically designed to remove epoxy compound spills that remain on the surface of the product during injection molding of lead frames. ESS-108 can remove epoxy compound overflow and transparent colloid at room temperature. In the process of removing epoxides, ESS-108 does not attack the metal materials of the lead frame such as copper and alloys, but merely removes the oxide on its surface.
View more
ESS-201 is an alkaline electrolytic process that can effectively remove the spilled sealant on plastic semiconductor components. After this process, the silver glue can be removed by high-pressure water and ultrasonic wave. The plating solution has the advantages of low cost, easy maintenance, easy treatment of wastewater, no halide, long life of the plating solution, low chemical oxygen consumption, and low anode corrosion of aging plating solution
View more
Neutral electric release GX-203 is a neutral electrolysis process that can effectively remove the plastic semiconductor overflow sealant without eroding the substrate. After this process, the silver glue can be removed by high-pressure water: The advantage is that the plating solution is neutral, halogen-free, can effectively remove the sealing glue and silver paste deposited on the substrate without discoloration of the substrate, mainly used for special degluing electroplating equipment, but also for ordinary plating
View more
ESS-802 is an acid deoxidizing powder, which can effectively remove the oxides on the surface of copper and alloy. It will not leave any stain when used on the refractory lead frame copper alloy. It is a low-acid, non-foam plating solution with short soaking time, high efficiency and wide operating range, which is suitable for all types of electroplating equipment
View more
Iron nickel deoxidizing powder
ESS-803 is a mixture of salts, catalysts and surface activators, the mixture of all components is balanced, can effectively remove metal surface oxides, impurities tolerance, especially suitable for iron, suitable for electrolysis activation of metal surface, such as: iron nickel alloy and copper coated nickel iron
View more
Neutralizing powder (ESS-303) : ESS-303 is an alkaline neutralizing powder, mainly used in the post-plating treatment of pure tin-lead alloy, which can effectively neutralize the residual acid on electroplated products, eliminate ion contamination, enhance solderability and extend the storage life of products
View more
ESS 301 is applied to connectors, lead frames and passive components and other immersed tin plating process, can form a uniform and stable surface structure, strengthen the solder surface of the tin coating, will not pollute the coating, after heat treatment, reflow and annealing treatment, can effectively prevent the tin coating in the reflow process discoloration, reduce the formation of oxide layer
View more
SAF Coolest v1.3 设置面板 HVOSX-ZUQD-MFSFE-ZXS
无数据提示
Sorry, there is currently no content in the current column!
You can view other columns or return to the homepage