Room temperature soaking solution
The ESS-108 is specifically designed to remove epoxy compound spills that remain on the surface of the product during injection molding of lead frames. ESS-108 can remove epoxy compound overflow and transparent colloid at room temperature. In the process of removing epoxides, ESS-108 does not attack the metal materials of the lead frame such as copper and alloys, but merely removes the oxide on its surface.
Classification:
Product Description
The ESS-108 is specifically designed to remove epoxy compound spills that remain on the surface of the product during injection molding of lead frames. ESS-108 can remove epoxy compound overflow and transparent colloid at room temperature. In the process of removing epoxides, ESS-108 does not attack the metal materials of the lead frame such as copper and alloys, but merely removes the oxide on its surface.
Non-toxic, does not burn and explode.
Avoid contact with eyes, skin and clothing.
Wear protective clothing, rubber gloves and goggles and store in a cool, dry and ventilated area. Further information can be found in the Product Safety Technical Documentation.
Product feature
Suitable for all EMC.
Does not attack metal substrates
Key words:
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