Deburring softening liquid
ESS-106 is a chemical immersion process specifically designed to remove excess spills from microelectronic products after packaging. After this process, excess spills can be removed with high pressure water. ESS-106 does not attack metal materials such as copper and alloys in the lead frame during the immersion process, and is suitable for all electronic plastic sealing products.
Classification:
Product Description
ESS-106 is a chemical immersion process specifically designed to remove excess spills from microelectronic products after packaging. After this process, excess spills can be removed with high pressure water. ESS-106 does not attack metal materials such as copper and alloys in the lead frame during the immersion process, and is suitable for all electronic plastic sealing products.
Non-toxic, does not burn and explode. Avoid contact with eyes, skin and clothing. Wear protective clothing, rubber gloves and safety goggles when using. Store in a cool, dry and well-ventilated area. Further information can be found in the Product Safety Technical Documentation.
Main products: pre-plating treatment, post-plating treatment: glue removal series of potions (alkaline, electric degluing agent), steel strip stripping series of potions, tin anti-discoloration and protective agent potions, and electronic additives series; Tin anode: tin ball, tin bar, tin rod and chemical products. Our company has established in-depth cooperation with Professor Zhang Zhiyong's team from Wuhan University of Light Industry. The company's service industries are semiconductor, PCB electronic circuit board, passive components, electronic connectors, LED and five electronic components, etc., is a research and development, production and sales of science and technology enterprises.
Key words:
Related Products
Company qualification
Quality Management System Certification
Environmental Management System Certification
Partners
Kingboard Group
Kyocera
phoenix aluminum
Sanhuan Group
YAGEO
Tyco
Changdian Technology
Xianke
Welcome your message consultation