Electronic additive series-Electronic additive series-湖北光祥化工科技有限公司 | 电镀行业

PRODUCT

Electroplate pretreatment & aftertreatment

Electronic additive series

Various specifications tin anode & chemical

Nickel anode

Tin anode

S-550 neutral tin plating additive

S-550 neutral tin plating process is designed to obtain uniform matte tin coating from organic sulfonate electrolyte. The plating solution is simple in composition and easy to control. The coating has excellent solderability and good walking ability. It is suitable for electroplating parts sensitive to PH in roll-on plating, such as magnetic cores, electric poles, glass sealing tubes, etc.

ST-200 Fog tin additive 1#

ST-200 mist tin is a high speed and low foam organic acid pure tin electroplating solution with a wide range of current density. It is suitable for semiconductor lead frame plating, deposits uniform mist tin coating with fine crystallization and good weldability. At the same time agent stone tin plating additive 530M

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