Room Temperature Soaking Solution
Key words:
Products
News
Room temperature soaking solution
The ESS-108 is specifically designed to remove epoxy compound spills that remain on the surface of the product during injection molding of lead frames. ESS-108 can remove epoxy compound overflow and transparent colloid at room temperature. In the process of removing epoxides, ESS-108 does not attack the metal materials of the lead frame such as copper and alloys, but merely removes the oxide on its surface.
Key words:
News