Room Temperature Soaking Solution

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Room temperature soaking solution

The ESS-108 is specifically designed to remove epoxy compound spills that remain on the surface of the product during injection molding of lead frames. ESS-108 can remove epoxy compound overflow and transparent colloid at room temperature. In the process of removing epoxides, ESS-108 does not attack the metal materials of the lead frame such as copper and alloys, but merely removes the oxide on its surface.