Description of solution temperature for continuous electroplating
Release time:
2023-07-29
During continuous electroplating, the plated metal or other insoluble material is used as the anode, the workpiece to be plated is used as the cathode, and the cation of the plated metal is reduced on the surface of the workpiece to be plated to form the coating. In order to eliminate the interference of other cations and make the coating uniform and firm, it is necessary to use the solution containing the metal cation of the coating as the plating solution to keep the concentration of the metal cation of the coating unchanged.
During continuous electroplating, the plated metal or other insoluble materials are used as anodes, the workpiece to be plated is used as cathodes, and the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a plated layer. In order to eliminate the interference of other cations and make the coating uniform and firm, it is necessary to use the solution containing the metal cation of the coating as the plating solution to keep the concentration of the metal cation of the coating unchanged. The purpose of
is to coat the substrate with a metal coating to change the surface properties or dimensions of the substrate. Continuous plating can enhance the corrosion resistance of the metal (the coating metal is mostly corrosion-resistant metal), increase hardness, avoid abrasion, improve conductivity, smoothness, heat resistance and surface appearance.
When other conditions (referring to the constant voltage, the current will increase due to the accelerated ion diffusion rate), increasing the temperature of the solution will usually accelerate the cathode reaction rate and ion diffusion rate, reduce the cathode polarization effect, and thus will also make the coating crystal coarse. However, it cannot be considered that increasing the solution temperature is unfavorable. If it is properly matched with other process conditions, increasing the solution temperature will also achieve good results.
For example, increasing the temperature during continuous electroplating can increase the upper limit of the allowable cathode current density, and the increase of the cathode current density will increase the polarization of the cathode to make up for the lack of heating, so that not only will the coating crystallization become coarse and will speed up the deposition rate and improve production efficiency. In addition, it can also improve the conductivity of the solution, promote anodic dissolution, improve the cathode current efficiency (except chromium plating), reduce pinholes, reduce the internal stress of the coating and so on.
is to coat the substrate with a metal coating to change the surface properties or dimensions of the substrate. Continuous plating can enhance the corrosion resistance of the metal (the coating metal is mostly corrosion-resistant metal), increase hardness, avoid abrasion, improve conductivity, smoothness, heat resistance and surface appearance.
When other conditions (referring to the constant voltage, the current will increase due to the accelerated ion diffusion rate), increasing the temperature of the solution will usually accelerate the cathode reaction rate and ion diffusion rate, reduce the cathode polarization effect, and thus will also make the coating crystal coarse. However, it cannot be considered that increasing the solution temperature is unfavorable. If it is properly matched with other process conditions, increasing the solution temperature will also achieve good results.
For example, increasing the temperature during continuous electroplating can increase the upper limit of the allowable cathode current density, and the increase of the cathode current density will increase the polarization of the cathode to make up for the lack of heating, so that not only will the coating crystallization become coarse and will speed up the deposition rate and improve production efficiency. In addition, it can also improve the conductivity of the solution, promote anodic dissolution, improve the cathode current efficiency (except chromium plating), reduce pinholes, reduce the internal stress of the coating and so on.
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