Electrolytic spill removal
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ESS-201 is an alkaline electrolytic process that can effectively remove the spilled sealant on plastic semiconductor components. After this process, the silver glue can be removed by high-pressure water and ultrasonic wave. The plating solution has the advantages of low cost, easy maintenance, easy treatment of wastewater, no halide, long life of the plating solution, low chemical oxygen consumption, and low anode corrosion of aging plating solution
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