ST-200 Fog tin additive 1#

ST-200 mist tin is a high speed and low foam organic acid pure tin electroplating solution with a wide range of current density. It is suitable for semiconductor lead frame plating, deposits uniform mist tin coating with fine crystallization and good weldability. At the same time agent stone tin plating additive 530M

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Product Description

ST-200 mist tin is a high speed and low foam organic acid pure tin electroplating solution with a wide range of current density. It is suitable for semiconductor lead frame plating, deposits uniform mist tin coating with fine crystallization and good weldability. At the same time agent stone tin plating additive 530M.

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Company qualification


Quality Management System Certification

Quality Management System Certification

Environmental Management System Certification

Environmental Management System Certification

Partners


Kingboard Group

Kingboard Group

Kyocera

Kyocera

phoenix aluminum

phoenix aluminum

Sanhuan Group

Sanhuan Group

YAGEO

YAGEO

Tyco

Tyco

Changdian Technology

Changdian Technology

Xianke

Xianke

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