ST-200 Fog tin additive 1#
ST-200 mist tin is a high speed and low foam organic acid pure tin electroplating solution with a wide range of current density. It is suitable for semiconductor lead frame plating, deposits uniform mist tin coating with fine crystallization and good weldability. At the same time agent stone tin plating additive 530M
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ST-200 mist tin is a high speed and low foam organic acid pure tin electroplating solution with a wide range of current density. It is suitable for semiconductor lead frame plating, deposits uniform mist tin coating with fine crystallization and good weldability. At the same time agent stone tin plating additive 530M.
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