Tin Prill
Tin particles have high purity, low oxygen content, compact structure, and less residue and slag. After electroplating, the surface of the product is bright and uniform, without blackening or metal peeling. It can withstand high current density and work with uniform consumption, greatly reducing the amount of electroplating salt. The length, width, and thickness of the product can be customized according to customer requirements. Widely used in electronic industry welding, hardware electroplating, semiconductor, electronic products and other industries for electroplating tin. The product meets the requirements of Japanese industrial standard JIS Z3283-A and American industrial standard QQS 571E.
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Product Description
Tin particles have high purity, low oxygen content, compact structure, and less residue and slag. After electroplating, the surface of the product is bright and uniform, without blackening or metal peeling. It can withstand high current density and work with uniform consumption, greatly reducing the amount of electroplating salt. The length, width, and thickness of the product can be customized according to customer requirements. Widely used in electronic industry welding, hardware electroplating, semiconductor, electronic products and other industries for electroplating tin. The product meets the requirements of Japanese industrial standard JIS Z3283-A and American industrial standard QQS 571E.
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